High Speed PCB

Using materials such as ordinary board (FR4) and high-speed board (modified FR4, PPO), the product features high line distribution density, thin thickness, and small size through precise wiring and laser micro hole conduction design.

Technical capability：

①Number of floors: 4-12 floors

②Maximum delivery plate: 570mm x 720mm

③Maximum copper thickness (inner/outer): 3oz/2oz

④Maximum plate thickness: 3.5mm

⑤Maximum aspect ratio: 15:1

⑥Surface treatment: lead-free tin spraying, sinking gold, OSP, gold fingers

Technical characteristics：

①Precision wiring design with line width/spacing ≥ 2.0/2.0 mil (50.8/50.8 μ m)；

②Optional through hole, buried hole, laser micro hole and other conductive designs；

③Designs such as POFV, 3+N+3, ELIC, stepped, and embedded (planar resistors, discrete devices, heat dissipation copper blocks, etc.) can be used。

Application area

To further understand Konka's circuit technology capabilities, please contact our FAE.

Konka circuits, communication networks, IT, intelligent terminals, cloud service solutions